SK Hynix Unpacks Advanced Packaging Technologies, Including Intel EMIB, For Its Next-Gen HBM Memory As It Eyes 3D Structures For The Future

SK hynix has announced significant progress in its high-bandwidth memory roadmap, specifically regarding HBM4. According to reports from 헤럴드경제, the company has moved its 12-layer HBM4 chips into mass production, while its 16-layer chips are currently in the qualification phase. This development is coinciding with a broader shift in packaging strategies. The company is now eyeing 3D structures for future iterations of its hardware to enhance performance. Coverage from several outlets emphasizes a fundamental shift in how memory is architected for artificial intelligence.

Semivision reports that the AI memory hierarchy is being redefined as NAND begins to adopt an architecture similar to HBM, a trend referred to as HBF. This movement toward a more unified memory structure suggests a transition in how data is stored and accessed within AI systems. Context for these developments is provided by the activity of other industry players such as Sandisk. According to StorageReview.com, Sandisk has taped out its first HBF memory die. This specific milestone is part of a broader industry push toward HBF technology, with Sandisk targeting 2027 for the release of inference product samples.

The simultaneous push by SK hynix into HBM4 mass production and Sandisk's entry into the HBF space demonstrates an industry-wide race to optimize memory for AI inference and training workloads, moving beyond traditional memory constraints. Future developments to monitor include the final qualification of the 16-layer HBM4 chips and the transition of SK hynix's 3D structure concepts into tangible products. Observers will be looking for the actual release of Sandisk's inference product samples in 2027 to see if the HBF architecture successfully redefines the memory hierarchy as suggested by Semivision.